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8XC51GB CHMOS SINGLE-CHIP 8-BIT MICROCONTROLLER
Commercial Express
87C51GB 8 Kbytes OTP 8 Kbytes Internal Program Memory 83C51GB 8 Kbytes Factory Programmable ROM 80C51GB CPU with RAM and I O 8XC51GB 3 5 MHz to 12 MHz g20% VCC 8XC51GB-1 3 5 MHz to 16 MHz g20% VCC
Y Y Y
8 Kbytes On-Chip ROM OTP ROM 256 Bytes of On-Chip Data RAM Two Programmable Counter Arrays with 2 x 5 High Speed Input Output Channels Compare Capture Pulse Width Modulators Watchdog Timer Capabilities Three 16-Bit Timer Counters with Four Programmable Modes Capture Baud Rate Generation (Timer 2) Dedicated Watchdog Timer 8-Bit 8-Channel A D with Eight 8-Bit Result Registers Four Programmable Modes Programmable Serial Channel with Framing Error Detection Automatic Address Recognition Serial Expansion Port Programmable Clock Out Extended Temperature Range ( b 40 C to a 85 C)
Y
48 Programmable I O Lines with 40 Schmitt Trigger Inputs 15 Interrupt Sources with 7 External 8 Internal Sources 4 Programmable Priority Levels Pre-Determined Port States on Reset High Performance CHMOS Process TTL and CHMOS Compatible Logic Levels Power Saving Modes 64K External Data Memory Space 64K External Program Memory Space Three Level Program Lock System ONCE (ON-Circuit Emulation) Mode Quick Pulse Programming Algorithm MCS 51 Microcontroller Fully Compatible Instruction Set Boolean Processor Oscillator Fail Detect Available in 68-Pin PLCC
Y
Y Y Y
Y
Y Y Y Y Y Y Y
Y Y
Y
Y Y Y
Y Y Y
MEMORY ORGANIZATION
PROGRAM MEMORY Up to 8 Kbytes of the program memory can reside in the on-chip ROM Also the device can address up to 64K of program memory external to the chip DATA MEMORY This microcontroller has a 256 x 8 on-chip RAM In addition it can address up to 64 Kbytes of external data memory The Intel 8XC51GB is a single-chip control oriented microcontroller which is fabricated on Intel's CHMOS III-E technology The 8XC51GB is an enhanced version of the 8XC51FA and uses the same powerful instruction set and architecture as existing MCS 51 microcontroller products Added features make it an even more powerful microcontroller for applications that require On-Chip A D Pulse Width Modulation High Speed I O up down counting capabilities and memory protection features It also has a more versatile serial channel that facilitates multi-processor communications
Other brands and names are the property of their respective owners Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or copyright for sale and use of Intel products except as provided in Intel's Terms and Conditions of Sale for such products Intel retains the right to make changes to these specifications at any time without notice Microcomputer Products may have minor variations to this specification known as errata
COPYRIGHT
INTEL CORPORATION 1995
November 1994
Order Number 272337-002
8XC51GB
272337 - 1
Figure 1 8XC51GB Block Diagram
PROCESS INFORMATION
This device is manufactured on P629 0 a CHMOS III-E process Additional process and reliability information is available in Intel's Components Quality and Reliability Handbook Order No 210997
PACKAGES
Part 8XC51GB Prefix N Package Type 68-Pin PLCC
2
8XC51GB
PARALLEL I O PORTS
The 8XC51GB contains six 8-bit parallel I O ports All six ports are bidirectional and consist of a latch an output driver and an input buffer Many of the port pins have multiplexed I O and control functions
Port Pins as Inputs
The pins of all six ports are configured as inputs by writing a logic 1 to them Since Port 0 is an open drain port it provides a very high input impedance Since pins of Port 1 2 3 4 and 5 have weak pullups (which are always on) they source a small current when driven low externally All ports except Port 0 have Schmitt trigger inputs
Port Pins as Outputs
Port 0 has open drain outputs when it is not serving as the external data bus The internal pullup is active only when the pin is outputting a logic 1 during external memory access An external pullup resistor is required on Port 0 when it is serving as an output port Ports 1 2 3 4 and 5 have quasi-bidirectional outputs A strong pullup provides a fast rise time when the pin is set to a logic 1 This pullup turns on for two oscillator periods to drive the pin high and then turns off The pin is held high by a weak pullup Writing the P0 P1 P2 P3 P4 or P5 Special Function Register sets the corresponding port pins All six port registers are bit addressable
Port States During Reset
Ports 0 and 3 reset asynchronously to a one and Ports 1 2 4 and 5 reset to a zero asynchronously
PIN DESCRIPTIONS
The 8XC51GB will be packaged in the 68-lead PLCC package Its pin assignment is shown in Figure 2 VCC Supply Voltage VSS Circuit Ground
Diagram is for Pin Reference Only Package Size is Not to Scale
OTP only
272337 - 2
Figure 2 Pin Connections 3
8XC51GB
ALTERNATE PORT FUNCTIONS
Ports 0 1 2 3 4 and 5 have alternate functions as well as their I O function as described below Port Pin P0 0 ADO-P0 7 AD7 P1 0 T2 P1 1 T2EX P1 2 ECI P1 3 CEXO-P1 7 CEX4 P2 0 A8-P2 7 A15 P3 0 RXD P3 1 TXD P3 2 INT0 P3 3 INT1 P3 4 T0 P3 5 T1 P3 6 WR P3 7 RD P4 0 SEPCLK P4 1 SEPDAT P4 2 ECI1 P4 3 C1EX0-P4 7 C1EX4 P5 2 INT2-P5 6 INT6 RST Reset input A low on this pin for two machine cycles while the oscillator is running resets the device The port pins will be driven to their reset condition when a voltage below VIL max voltage is applied whether the oscillator is running or not An internal pullup resistor permits a power-on reset with only a capacitor connected to VSS ALE PROG Address Latch Enable output pulse for latching the low byte of the address during accesses to external memory This pin (ALE PROG) is also the program pulse input during programming of the 87C51GB In normal operation ALE is emitted at a constant rate of the oscillator frequency and may be used for external timing or clocking purposes Note however that one ALE pulse is skipped during each access to external Data Memory If desired ALE operation can be disabled by setting bit 0 of SFR location 8EH With this bit set the pin is weakly pulled high However the ALE disable feature will be suspended during a MOVX or MOVC instruction idle mode power down mode and ICE mode The ALE disable feature will be terminated by reset When the ALE disable feature is suspended or Alternate Function Multiplexed Address Data for External Memory Timer 2 External Clock Input Clock-Out Timer 2 Reload Capture Direction Control PCA External Clock Input PCA Capture Input Compare PWM Output High Byte of Address for External Memory Serial Port Input Serial Port Output External Interrupt 0 External Interrupt 1 Timer 0 External Clock Input Timer 1 External Clock Input Write Strobe for External Memory Read Strobe for External Memory Clock Source for Serial Expansion Port Data I O for the Serial Expansion Port PCA1 External Clock Input PCA1 Capture Input Compare PWM Output External Interrupt INT2 - INT6 terminated the ALE pin will no longer be pulled up weakly Setting the ALE-disable bit has no affect if the microcontroller is in external execution mode Throughout the remainder of this data sheet ALE will refer to the signal coming out of the ALE PROG pin and the pin will be referred to as the ALE PROG pin PSEN Program Store Enable is the read strobe to external Program Memory When the 8XC51GB is executing code from external Program Memory PSEN is activated twice each machine cycle except that two PSEN activations are skipped during each access to external Data Memory EA VPP External Access enable EA must be strapped to VSS in order to enable the device to fetch code from external Program Memory locations 0000H to 1FFFH Note however that if either of the Program Lock bits are programmed EA will be internally latched on reset EA should be strapped to VCC for internal program executions
4
8XC51GB
This pin also receives the 12 75V programming supply voltage (VPP) during programming (OTP only) XTAL1 Input to the inverting oscillator amplifier XTAL2 Output from the inverting oscillator amplifier common timing reference Each Register Comparator Module is associated with a pin of Port 1 or Port 4 and is capable of performing input capture output compare and pulse width modulation functions The PCAs are exactly the same in function except for the addition of clock input sources on PCA1 The PCA Counter and five Register Comparator Modules each have a status bit in the CCON C1CON Special Function Registers These six status bits are set according to the selected modes of operation described below The CCON C1CON Register provides a convenient means to determine which of the six PCA PCA1 interrupts has occurred The EC Bit in the IE (Interrupt Enable) Special Function Register is a global interrupt enable for the PCA
A D CONVERTER
The 8XC51GB A D converter has a resolution of 8 bits and an accuracy of g1 LSB (g2 LSB for channels 0 and 1) The conversion time for a single channel is 20 ms at a clock frequency of 16 MHz with the sample and hold function included Independent supply voltages are provided for the A D Also the A D operates both in Normal Mode or in Idle Mode The A D has 8 analog input pins ACH0 (A D CHannel 0) ACH7 1 reference input pin COMPREF (COMParison REFerence) 1 control input pin TRIGIN (TRIGger IN) and 2 power pins AVREF (Voltage REFerence) and analog ground (ANalog GrouND) In addition the A D has 8 conversion result registers ADRES0 (A D result for channel 0) ADRES7 1 comparison result register ACMP (Analog Comparison) and 1 control register ACON (A D Control) The control bit ACE (A D Conversion Enable) in ACON controls whether the A D is in operation or not ACE e 0 idles the A D ACE e 1 enables A D conversion The control bit AIM (A D Input mode) in ACON controls the mode of channel selection AIM e 0 is the Scan Mode and AIM e 1 is the Select Mode The result registers ADRES4 ADRES7 always contain the result of a conversion from the corresponding channels ACH4 CH7 However the result registers ADRES0 ADRES3 depend on the mode selected In the scan mode ADRES0 ADRES3 contain the values from ACH0 ACH3 In the Select Mode one of the four channels ACH0 ACH3 is converted four times and the four values are stored sequentially in locations ADRES0 ADRES3 Its channel is selected by bits ACS1 and ACS0 (A D Channel Select 1 and 0) in ACON
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Figure 3 Programmable Counter Arrays
OSCILLATOR CHARACTERISTICS
XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be configured for use as an on-chip oscillator as shown in Figure 4 Either a quartz crystal or ceramic resonator may be used More detailed information concerning the use of the on-chip oscillator is available in Application Note AP-155 ``Oscillators for Microcontrollers '' Order No 230659 To drive the device from an external clock source XTAL should be driven while XTAL2 floats as shown in Figure 5 There are no requirements on the duty cycle of the external clock signal since the input to the internal clocking circuitry is through a divide-by-two flip-flop but minimum and maximum high and low times specified on the data sheet must be observed
PROGRAMMABLE COUNTER ARRAYS
The Programmable Counter Arrays (PCA-PCA1) are each made up of a Counter Module and five Register Comparator Modules as shown below The 16-bit output of the counter module is available to all five Register Comparator Modules providing one
5
8XC51GB
POWER DOWN MODE
To save even more power a Power Down mode can be invoked by software In this mode the oscillator is stopped and the instruction that invoked Power Down is the last instruction executed The on-chip RAM and Special Function Registers retain their values until the Power Down mode is terminated
272337 - 4
C1 C2 e 30 pF g10 pF for Crystals For Ceramic Resonators contact resonator manufacturer
Figure 4 Oscillator Connections
On the 8XC51GB either a hardware reset or an external interrupt can cause an exit from Power Down Reset redefines all the SFRs but does not change the on-chip RAM An external interrupt does not redefine the SFR's or change the on-chip RAM An external interrupt will modify the interrupt associated SFR's in the same way an interrupt will in all other modes The interrupt must be enabled and configured as level sensitive To properly terminate Power Down the reset or external interrupt should not be executed before VCC is restored to its normal operating level The reset or external interrupt must be held active long enough for the oscillator to restart and stabilize The Oscillator Fail Detect must be disabled prior to entering Power Down
272337 - 5
DESIGN CONSIDERATIONS
When the idle mode is terminated by a hardware
reset the device normally resumes program execution from where it left off up to two machine cycles before the internal reset algorithm takes control On-chip hardware inhibits access to internal RAM in this event but access to the port pins is not inhibited To eliminate the possibility of an unexpected write when Idle is terminated by reset the instruction following the one that invokes Idle should not be one that writes to a port pin or to external memory
Figure 5 External Clock Drive Configuration
IDLE MODE
The user's software can invoke the Idle Mode When the microcontroller is in this mode power consumption is reduced The Special Function Registers and the onboard RAM retain their values during idle peripherals continue to operate but the processor stops executing instructions Idle Mode will be exited if the chip is reset or if an enabled interrupt occurs The PCA timer counter can optionally be left running or paused during Idle Mode The Watchdog Timer continues to count in Idle Mode and must be serviced to prevent a device RESET while in Idle
As RESET rises the 8XC51GB will remain in reset for up to 5 machine cycles (60 oscillator periods) after RESET reaches VIH1
Table 1 Status of the External Pins during Idle and Power Down Mode Idle Idle Power Down Power Down Program Memory Internal External Internal External ALE 1 1 0 0 PSEN 1 1 0 0 PORT0 Data Float Data Float PORT1 Data Data Data Data PORT2 Data Address Data Data PORT3 Data Data Data Data
NOTE For more detailed information on the reduced power modes refer to current Embedded Microcontrollers and Processors Handbook Volume I (Order No 270645) and Application Note AP-252 (Embedded Applications Handbook Order No 270648) ``Designing with the 80C51BH ''
6
8XC51GB
ONCE MODE
The ONCE (``On-Circuit Emulation'') Mode facilitates testing and debugging of systems using the 8XC51GB without removing it from the circuit The ONCE Mode is invoked by 1) Pulling ALE low while the device is in reset and PSEN is high 2) Holding ALE low as RESET is deactivated While the device is in ONCE Mode the Port 0 pins float and the other port pins and ALE and PSEN are weakly pulled high The oscillator circuit remains active While the 8XC51GB is in this mode an emulator or test CPU can be used to drive the circuit Normal operation is restored when a normal reset is applied
Serial Expansion Port (SEP)
The Serial Expansion Port is a half-duplex synchronous serial interface with the following features Four Clock Frequencies Four Interface Modes Edges Interrupt Driven XTAL 12 24 48 96 High Low Falling Rising
Oscillator Fail Detect (OFD)
The Oscillator Fail Detect circuitry triggers a reset if the oscillator frequency is lower than the OFD trigger frequency It can be disabled by software by writing E1H followed by 1EH to the OFDCON register Before going into Power Down Mode the OFD must be disabled or it will force the GB out of Power Down The OFD has the following features OFD Trigger Frequency Below 20 KHz the 8XC51GB will be held in reset Above 400 KHz the 8XC51GB will not be held is reset Functions in Normal and Idle Modes Reactivated by Reset (or External Interrupt Zero One Pins) after Software Disable
Watchdog Timer (WDT)
The 8XC51GB contains a dedicated Watchdog Timer (WDT) to allow recovery from a software or hardware upset The WDT consists of a 14-bit counter which is cleared on Reset and subsequently incremented every machine cycle While the oscillator is running the WDT will be incrementing and cannot be disabled The counter may be reset by writing 1EH and E1H in sequence to the WDTRST Special Function Register If the counter is not reset before it reaches 3FFFH (16383D) the chip will be forced into a reset sequence by the WDT This works out to 12 28 ms 16 MHz WDTRST is a write only register The WDT does not force the external reset pin low While in Idle mode the WDT continues to count If the user does not wish to exit Idle with a reset then the processor must be periodically ``woken up'' to service the WDT In Power Down mode the WDT stops counting and holds its current value
8XC51GB EXPRESS
The Intel EXPRESS products are designed to meet the needs of those applications whose operating requirements exceed commercial standards With the commercial standard temperature range operational characteristics are guaranteed over the temperature range of 0 C to a 70 C With the extended temperature range option operational characteristics are guaranteed over the range of b 40 C to a 85 C The 87C51GB EXPRESS is packaged in the 68-lead PLCC package In order to designate a part as an EXPRESS part a ``T'' is added as a prefix to the part number TN87C51GB denotes an EXPRESS part in a PLCC package All AC and DC parameters in this data sheet apply to the EXPRESS devices
7
8XC51GB
ABSOLUTE MAXIMUM RATINGS
Ambient Temperature under Bias Storage Temperature Voltage on EA VPP Pin to VSS IOL per I O Pin Voltage on Any Other Pin to VSS 0 C to a 70 C
b 65 C to a 150 C
NOTICE This data sheet contains preliminary information on new products in production The specifications are subject to change without notice Verify with your local Intel Sales office that you have the latest data sheet before finalizing a design
0V to a 13 0V 15 mA
b 0 5V to a 6 5V
Power Dissipation 1 5W (Based on Package heat transfer limitations not device power consumption) OTP only
WARNING Stressing the device beyond the ``Absolute Maximum Ratings'' may cause permanent damage These are stress ratings only Operation beyond the ``Operating Conditions'' is not recommended and extended exposure beyond the ``Operating Conditions'' may affect device reliability
OPERATING CONDITIONS
Symbol TA Description Ambient Temperature Under Bias Commercial Express Supply Voltage Oscillator Frequency 8XC51GB 8XC51GB-1 Min 0
b 40
Max
a 70 a 85
Units C C V MHz MHz
VCC fOSC
40 35 35
60 12 16
DC CHARACTERISTICS
Symbol VIL VIL1 VIL2 VIH VIH1 VOL Parameter
(Over Operating Conditions) Min
b0 5 b0 5
Typ(1)
Max 0 2 VCC b 0 1 0 2 VCC b 0 3 0 2 VCC b 0 3 VCC a 0 5 VCC a 0 5 03 0 45 10
Unit V V V V V V V V V V V
Test Conditions
Input Low Voltage (except Port 2 and EA) Input Low Voltage (Port 2) Input Low Voltage (EA) Input High Voltage (except XTAL1 and RST) Input High Voltage (XTAL1 RST) Output Low Voltage (Ports 1 2 3 4 and 5)
0 0 2 VCC a 0 9 0 7 VCC
IOL e 100 mA (2 3) IOL e 1 6 mA (2 3) IOL e 3 5 mA (2 3) IOL e 200 mA (2 3) IOL e 3 2 mA (2 3) IOL e 7 0 mA (2 3)
VOL1
Output Low Voltage (Port 0 PSEN ALE)
03 0 45 10
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8XC51GB
DC CHARACTERISTICS
Symbol VOH
(Over Operating Conditions) (Continued) Min VCC b 0 3 VCC b 0 7 VCC b 1 5 VCC b 0 3 VCC b 0 7 VCC b 1 5
b 50 b 650
Parameter Output High Voltage (Ports 1 2 3 4 and 5 ALE PSEN) Output High Voltage (Port 0 in External Bus Mode) Logical 0 Input Current (Ports 1 2 3 4 5) Logical 1-to-0 Transition Current (Ports 1 2 3 4 5) Input Leakage Current (Port 0) RST Pullup Resistor Pin Capacitance Power Down Current Idle Mode Current Operating Current 16 MHz
Typ(1)
Max
Unit V V V V V V mA mA mA kX pF
Test Conditions IOH e b 10 mA (4) IOH e b 30 mA (4) IOH e b 60 mA (4) IOH e b 200 mA IOH e b 3 2 mA IOH e b 7 0 mA VIN e 0 45V VIN e 2 0V 0 45 k VIN k VCC
VOH1
IIL ITL ILI RRST CIO IPD IDL ICC IREF
g10
50 10
300
Freq e 1 MHz TA e 25 C (5) (5) (5)
50 18 50 5
mA mA mA mA
A D Converter Reference Current
NOTES 1 Typical values are obtained using VCC e 5 0V TA e 25 C and are not guaranteed 2 Under steady state (non-transient) conditions IOL must be externally limited as follows 10 mA Maximum IOL per Port Pin Maximum IOL per 8-Bit Port Port 0 26 mA Ports 1-5 15 mA Maximum Total IOL for All Outputs Pins 101 mA If IOL exceeds the test conditions VOL may exceed the related specification Pins are not guaranteed to sink current greater than the listed test conditions 3 Capacitive loading on Ports 0 and 2 may cause spurious noise pulses above 0 4V on the low level outputs of ALE and Ports 1 2 and 3 The noise is due to external bus capacitance discharging into the Port 0 and Port 2 pins when these pins change from 1 to 0 In applications where capacitive loading exceeds 100 pF the noise pulses on these signals may exceed 0 8V It may be desirable to qualify ALE or other signals with a Schmitt Trigger or CMOS-level input logic 4 Capacitive loading on Ports 0 and 2 cause the VOH on ALE and PSEN to drop below the 0 9 VCC specification when the address lines are stabilizing 5 See Figures 6-10 for test conditions Minimum VCC for Power Down is 2V
9
8XC51GB
272337 - 7
All other pins disconnected TCLCH e TCHCL e 5 ns
272337 - 6
ICC Max at other frequencies is given by Active Mode ICC Max e (Osc Freq c 3) a 4 Idle Mode ICC Max e (Osc Freq c 0 5) a 4 Where Osc Freq is in MHz ICC is in mA TCLCH e TCHCL e 5 ns
Figure 7 ICC Test Condition Active Mode
Figure 6 ICC vs Frequency
272337 - 8
272337 - 9
All other pins disconnected TCLCH e TCHCL e 5 ns
All other pins disconnected
Figure 8 ICC Test Condition Idle Mode
Figure 9 ICC Test Condition Power Down Mode VCC e 2 0V to 5 5V
272337 - 10
Figure 10 Clock Signal Waveform for ICC Tests in Active and Idle Modes TCLCH e TCHCL e 5 ns
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8XC51GB
L Logic Level LOW or ALE P PSEN Q Output Data R RD Signal T Time V Valid W WR Signal X No Longer a Valid Logic Level Z Float For Example TAVLL e Time from Address Valid to ALE Low TLLPL e Time from ALE Low to PSEN Low
EXPLANATION OF THE AC SYMBOLS
Each timing symbol has 5 characters The first character is always a ``T'' (stands for time) The other characters depending on their positions stand for the name of a signal or the logical status of that signal The following is a list of all the characters and what they stand for A Address C Clock D Input Data H Logic Level HIGH I Instruction (Program Memory Contents)
AC SPECIFICATIONS
Over Operating Conditions Load Capacitance on Port 0 ALE and PSEN e 100 pF Load Capacitance on all other outputs e 80 pF
EXTERNAL PROGRAM AND DATA MEMORY CHARACTERISTICS
Symbol 1 TCLCL TLHLL TAVLL TLLAX TLLIV TLLPL TPLPH TPLIV TPXIX TPXIZ TAVIV TPLAZ TRLRH TWLWH TRLDV TRHDX TRHDZ TLLDV TAVDV TLLWL TAVWL TQVWX TWHQX TQVWH TRLAZ TWHLH Parameter Osc Freq ALE Pulse Width ADDR Valid to ALE Low ADDR Hold after ALE Low ALE Low to Valid Inst IN ALE LOW to PSEN LOW PSEN Pulse Width PSEN Low to Valid Instr In Input Instr Hold after PSEN Input Instr Float after PSEN ADDR to Valid Instr In PSEN Low to ADDR Float RD Pulse Width WR Pulse Width RD Low to Valid Data In Data Hold after RD Data Float after RD ALE Low to Valid Data In ADDR to Valid Data In ALE Low to RD or WR Low ADDR Valid to RD or WR Low Data Valid to WR Transition Data Hold after WR Data Valid to WR High RD Low to Addr Float RD or WR High to ALE High 43 200 203 33 33 433 0 123 TCLCL b 40 0 107 517 585 300 3TCLCL b 50 4TCLCL b 130 TCLCL b 50 TCLCL b 50 7 TCLCL b 150 0 TCLCL a 40 400 400 252 0 2TCLCL b 60 8TCLCL b 150 9TCLCL b 165 3TCLCL a 50 0 59 312 10 6TCLCL b 100 6TCLCL b 100 5TCLCL b 165 53 205 145 0 TCLCL b 25 5TCLCL b 105 10 127 43 53 234 TCLCL b 30 3TCLCL b 45 3TCLCL b 105 12 MHz Osc Min Max Min 35 2TCLCL b 40 TCLCL b 40 TCLCL b 30 4TCLCL b 100 Variable Osc Max 16 Units MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 11
8XC51GB
EXTERNAL PROGRAM MEMORY READ CYCLE
272337 - 11
EXTERNAL DATA MEMORY READ CYCLE
272337 - 12
EXTERNAL DATA MEMORY WRITE CYCLE
272337 - 13
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8XC51GB
SERIAL PORT TIMING
Symbol TXLXL TQVXH TXHQX TXHDX TXHDV Parameter
SHIFT REGISTER MODE
12 MHz Oscillator Min Max 1 700 50 0 700 Variable Oscillator Min 12TCLCL 10TCLCL b 133 2TCLCL b 117 0 10TCLCL b 133 Max ms ns ns ns ns Units
Test Conditions Over Operating Conditions Load Capacitance e 80 pF
Serial Port Clock Cycle Time Output Data Setup to Clock Rising Edge Output Data Hold after Clock Rising Edge Input Data Hold after Clock Rising Edge Clock Rising Edge to Input Data Valid
SHIFT REGISTER MODE TIMING WAVEFORMS
272337 - 14
EXTERNAL CLOCK DRIVE
Symbol 1 TCLCL TCHCX TCLCX TCLCH TCHCL Parameter Oscillator Frequency High Time Low Time Rise Time Fall Time Min 35 20 20 Max 16 Units MHz ns ns ns ns
20 20
EXTERNAL CLOCK DRIVE WAVEFORM
272337 - 15
13
8XC51GB
SEP AC TIMING SPECIFICATIONS
Test Conditions Over Operating Conditions Load Capacitance e 80 pF Symbol TXSXL TXSST TXSOH TXSIH TXSDV Parameter SEPCLK Cycle Time Output Data Setup to SEPCLK Output Data Hold after SEPCLK Input Data Hold after SEPCLK Sampling Edge Input Data Valid to SEPCLK Sampling Edge 12 MHz Oscillator Min 1 435 445 210 947 Max Min 12 TCLCL 6 TCLCL b 65 6 TCLCL b 55 2 TCLCL a 43 12 TCLCL b 53 Variable Oscillator Max ms ns ns ns ns Units
SEP Waveform (SEPS1 e 0
SEPS0 e 0 CLKPOL e 0 CLKPH e 0)
272337 - 16
272337 - 17
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8XC51GB
AC TESTING INPUT OUTPUT WAVEFORMS
FLOAT WAVEFORMS
272337 - 18
272337 - 19
AC inputs during testing are driven at VCCb0 5V for a Logic ``1'' and 0 5V for a Logic ``0'' Timing measurements are made at VIH for a Logic ``1'' and VOL max for a Logic ``0''
For timing purposes a port pin is no longer floating when a 100 mV change from load voltage occurs and begins to float when a 100 mV change from the loaded VOH VOL level occurs IOL IOH t g20 mA
A TO D CHARACTERISTICS
The absolute conversion accuracy is dependent on the accuracy of AVREF The specifications given below assume adherence to the Operating Conditions section of this data sheet Testing is done at AVREF e 5 12V and VCC e 5 0V
OPERATING CONDITIONS
VCC AVREF VSS AVSS ACH0 - 7 TA FOSC (STD Version) FOSC (-1 Version) 4 0V to 6 0V 4 5V to 5 5V 0V AVSS to VREF 0 C to a 70 C Ambient 3 5 MHz to 12 MHz 3 5 MHz to 16 MHz
A D CONVERTER SPECIFICATIONS
Parameter Resolution Absolute Error (Ch 2-7) Absolute Error (Ch 0 and 1) Full Scale Error Zero Offset Error Non-Linearity Differential Non-Linearity Channel-to-Channel Matching Repeatability 0 0 0 Min 256 8 0 0
TA e 0 C to a 70 C Typ Max 256 8
g1 g2 g1 g1 g1 g1 g1 g0 25
Units Levels Bits LSB LSB LSB LSB LSB LSB LSB LSB
Notes
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8XC51GB
A D CONVERTER SPECIFICATIONS
Parameter Temperature Coefficients Offset Full Scale Differential Non-Linearity Input Capacitance Off Isolation Feedthrough VCC Power Supply Rejection Input Resistance to Sample-and-Hold Capacitor DC Input Leakage 750 0
b 60
TA e 0 C to a 70 C (Continued) Typ 0 003 0 003 0 003 3 Max Units LSB C LSB C LSB C pF dB
b 60 b 60
Min
Notes
(8 9) (8) (8)
dB dB 1 2K 30 X mA
NOTES These values are expected for most parts at 25 C AN ``LSB'' as used here has a value of approximately 20 mV 8 DC to 100 KHz 9 Multiplexer Break-Before-Make Guaranteed 10 There is no indication when a single A D conversion is complete Please refer to the 8XC51GB Hardware Description on how to read a single A D conversion 11 TCY e 12 TCLCL
A D Conversion Time Per Channel 8 Conversions 26 TCY 208 TCY
Notes (10 11) (11)
16
8XC51GB
PROGRAMMING THE OTP
The part must be running with a 4 MHz to 6 MHz oscillator The address of a location to be programmed is applied to address lines while the code byte to be programmed in that location is applied to data lines Control and program signals must be held at the levels indicated in Table 2 Normally EA VPP is held at logic high until just before ALE PROG is to be pulsed The EA VPP is raised to VPP ALE PROG is pulsed low and then EA VPP is returned to a high (also refer to timing diagrams) NOTE Exceeding the VPP maximum for any amount of time could damage the device permanently The VPP source must be well regulated and free of glitches
DEFINITION OF TERMS
ADDRESS LINES P1 0 - P1 7 P2 0 - P2 4 respectively for A0 - A12 DATA LINES P0 0 - P0 7 for D0 - D7 CONTROL SIGNALS RST PSEN P2 6 P2 7 P3 3 P3 6 P3 7 PROGRAM SIGNALS ALE PROG EA VPP
272337 - 20 See Table 2 for proper input on these pins
Figure 11 Programming the OTP Table 2 OTP Programming Modes Mode Program Code Data Verify Code Data Program Encryption Array Address 0-3FH Program Lock Bits Bit 1 Bit 2 Bit 3 Read Signature Byte RST L L L L L L L PSEN L L L L L L H H H ALE PROG EA VPP 12 75V H 12 75V 12 75V 12 75V 12 75V H P2 6 L L L H H H L P2 7 H L H H H L L P3 3 H L H H H H L P3 6 H H L H L H L P3 7 H H H H L L L 17
8XC51GB
Repeat 1 through 5 changing the address and data for the entire array or until the end of the object file is reached
PROGRAMMING ALGORITHM
Refer to Table 2 and Figures 11 and 12 for address data and control signals set up To program the 87C51GB the following sequence must be exercised 1 Input the valid address on the address lines 2 Input the appropriate data byte on the data lines 3 Activate the correct combination of control signals 4 Raise EA VPP from VCC to 12 75V g0 25V 5 Pulse ALE PROG 5 times for the OTP array and 25 times for the encryption table and the lock bits
PROGRAM VERIFY
Program verify may be done after each byte that is programmed or after a block of bytes that is programmed In either case a complete verify of the array will ensure that it has been programmed correctly The lock bits cannot be directly verified Verification of the lock bits is done by observing that their features are enabled Refer to the Program Lock section in this data sheet
272337 - 21
Figure 12 Programming Signal's Waveforms
18
8XC51GB
When using the encryption array feature one important factor needs to be considered If a code byte has the value 0FFH verification of the byte will produce the encryption byte value If a large block ( l 64 bytes) of code is left unprogrammed a verification routine will display the contents of the encryption array For this reason it is strongly recommended that all unused code bytes be programmed with some value other than 0FFH and not all of them the same value This practice will ensure the maximum possible program protection
ROM and EPROM Lock System
The 87C51GB and the 83C51GB program lock systems when programmed protect the on-board program against software piracy The 83C51GB has a one-level program lock system and a 64-byte encryption table See line 2 of Table 3 If program protection is desired the user submits the encryption table with their code and both the lock bit and encryption array are programmed by the factory The encryption array is not available without the lock bit For the lock bit to be programmed the user must submit an encryption table The 87C51GB has a 3-level program lock system and a 64-byte encryption array Since this is an EPROM device all locations are user programmable See Table 3
Program Lock Bits
The 87C51GB has 3 programmable lock bits that when programmed according to Table 3 will provide different levels of protection for the on-chip code and data The 83C51GB has 1 program lock bit See line 2 of Table 3
Encryption Array
Within the programmable array are 64 bytes of Encryption Array that are initially unprogrammed (all 1's) Every time that a byte is addressed during a verify 5 address lines are used to select a byte of the Encryption Array This byte is then exclusiveNOR'ed (XNOR) with the code byte creating an Encryption Verify byte The algorithm with the array in the unprogrammed state (all 1's) will return the code in its original unmodified form For programming the Encryption Array refer to Table 2
Reading the Signature Bytes
The 8XC51GB has 3 signature bytes in locations 30H 31H and 60H To read these bytes follow the procedure for verify but activate the control lines provided in Table 2 for Read Signature Byte Location 30H 31H 60H Table 3 Program Lock Bits and the Features 89H 58H EBH Contents 87C51GB 83C51GB 89H 58H EBH 6BH
Program Lock Bits LB1 1 U LB2 U LB3 U
Protection Type No Program Lock features enabled (Code verify will still be encrypted by the Encryption Array if programmed) MOVC instructions executed from external program memory are disabled from fetching code bytes from internal memory EA is sampled and latched on Reset and further programming of the EPROM is disabled Same as 2 also verify is disabled Same as 3 also external execution is disabled
2
P
U
U
3 4
P P
P P
U P
Any other combination of lock bits is not defined
19
8XC51GB
OTP PROGRAMMING AND VERIFICATION CHARACTERISTICS
(TA e 21 C to 27 C VCC e 5V g 20% VSS e 0V) Symbol VPP IPP 1 TCLCL TAVGL TGHAX TDVGL TGHDX TEHSH TSHGL TGHSL TGLGH TAVQV TELQV TEHQZ TGHGL Parameter Programming Supply Voltage Programming Supply Current Oscillator Frequency Address Setup to PROG Low Address Hold after PROG Data Setup to PROG Low Data Hold after PROG (Enable) High to VPP VPP Setup to PROG Low VPP Hold after PROG PROG Width Address to Data Valid ENABLE Low to Data Valid Data Float after ENABLE PROG High to PROG Low 0 10 4 48TCLCL 48TCLCL 48TCLCL 48TCLCL 48TCLCL 10 10 90 110 48TCLCL 48TCLCL 48TCLCL ms ms ms ms Min 12 5 Max 13 0 75 6 Units V mA MHz
PROGRAMMING AND VERIFICATION WAVEFORMS
272337 - 22
25 Pulses for Encryption Table and Lock Bits
20
8XC51GB
Ideal Characteristic A characteristic with its first code transition at VIN e 0 5 LSB its last code transition at VIN e (VREF b 1 5 LSB) and all code widths equal to one LSB Input Resistance The effective series resistance from the analog input pin to the sample capacitor LSB Least Significant Bit The voltage corresponding to the full scale voltage divided by 2n where n is the number of bits of resolution of the converter For an 8-bit converter with a reference voltage of 5 12V one LSB is 20 mV Note that this is different than digital LSBs since an uncertainty of two LSBs when referring to an A D converter equals 40 mV (This has been confused with an uncertainty of two digital bits which would mean four counts or 80 mV) Monotonic The property of successive approximation converters which guarantees that increasing input voltages produce adjacent codes of increasing value and that decreasing input voltages produce adjacent codes of decreasing value No Missed Codes For each and every output code there exists a unique input voltage range which produces that code only Non-Linearity The maximum deviation of code transitions of the terminal based characteristic from the corresponding code transitions of the ideal characteristic Off-Isolation Attenuation of a voltage applied on a deselected channel of the A D converter (Also referred to as Crosstalk ) Repeatability The difference between corresponding code transitions from different actual characteristics taken from the same converter on the same channel at the same temperature voltage and frequency conditions Resolution The number of input voltage levels that the converter can unambiguously distinguish between Also defines the number of useful bits of information which the converter can return Sample Delay The delay from receiving the start conversion signal to when the sample window opens Sample Delay Uncertainty sample delay Sample Time open The variation in the
A D Glossary of Terms
Absolute Error The maximum difference between corresponding actual and ideal code transitions Absolute Error accounts for all deviations of an actual converter from an ideal converter Actual Characteristic The characteristic of an actual converter The characteristic of a given converter may vary over temperature supply voltage and frequency conditions An actual characteristic rarely has ideal first and last transition locations or ideal code widths It may even vary over multiple conversions under the same conditions Break-Before-Make The property of a multiplexer which guarantees that a previously selected channel will be deselected before a new channel is selected (e g the converter will not short inputs together) Channel-to-Channel Matching The difference between corresponding code transitions of actual characteristics taken from different channels under the same temperature voltage and frequency conditions Characteristic A graph of input voltage versus the resultant output code for an A D converter It describes the transfer function of the A D converter Code The digital value output by the converter
Code Center The voltage corresponding to the midpoint between two adjacent code transitions Code Transition The point at which the converter changes from an output code of Q to a code of Q a 1 The input voltage corresponding to a code transition is defined to be that voltage which is equally likely to produce either of two adjacent codes Code Width The voltage corresponding to the difference between two adjacent code transitions Crosstalk See ``Off-Isolation''
DC Input Leakage Leakage current to ground from an analog input pin Differential Non-Linearity The difference between the ideal and actual code widths of the terminal based characteristic Feedthrough Attenuation of a voltage applied on the selected channel of the A D Converter after the sample window closes Full Scale Error The difference between the expected and actual input voltage corresponding to the full scale code transition
The time that the sample window is The variation in the 21
Sample Time Uncertainty sample time
8XC51GB
Sample Window Begins when the sample capacitor is attached to a selected channel and ends when the sample capacitor is disconnected from the selected channel Successive Approximation An A D conversion method which uses a binary search to arrive at the best digital representation of an analog input Temperature Coefficients Change in the stated variable per degree centrigrade temperature change Temperature coefficients are added to the typical values of a specification to see the effect of temperature drift Terminal Based Characteristic An actual characteristic which has been rotated and translated to remove zero offset and full scale error VCC Rejection Attenuation of noise on the VCC line to the A D converter Zero Offset The difference between the expected and actual input voltage corresponding to the first code transition The following differences exist between the 270869-002 data sheet and the previous version (270869-001) 1 Changed data sheet status from ``Product Preview'' to ``Advance Information'' and updated associated notices 2 Asynchronous port reset was added to RESET pin description 3 ALE disable paragraph was added to ALE pin description 4 C1 C2 guidelines clarified in Figure 4 5 Operating Conditions heading was added 6 Maximum IOL per I O pin was added to Absolute Maximum Ratings 7 VT a VTb VHYS VOL2 and VTL removed 8 VOL value for ALE included with VOL1 9 VIL1 and VIL2 added 10 RRST minimum changed from 40K to 50K RRST maximum changed from 225K to 300K 11 IPD maximum changed from 200 mA to 50 mA 12 IDL maximum changed from 15 mA to 18 mA 13 Typical values for IPD IDL ICC and IREF removed 14 Note 3 (page 9) was reworded 15 SEP AC Timings added 16 A D Absolute Error for Channels 0 and 1 changed to g2 LSB 17 TCY clarified 18 Encryption array paragraph was added 19 Corrected pin numbers on Figure 11 to reflect PLCC package
DATA SHEET REVISION SUMMARY
The following differences exist between this datasheet and the previous version (270869-003) 1 Merged 87C51GB Express (270889-001) 2 New order number 272337-001 The following differences exist between the 270869003 data sheet and the previous version (270869002) 1 Changed data sheet status from ``Advance Information'' to ``Preliminary'' and updated associated notices 2 Added 83C51GB throughout 3 Added Package and Process Information 4 Clarified g2 LSB accuracy for channels 0 and 1 in A D Converter Section 5 Added ``ROM and EPROM Lock System'' section and added 83C51GB to ``Program Lock Bits'' section 6 Modified Signature Bytes Table
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